But also in the Advanced SiP segment where component-to-component spacing is approaching 50µm gaps Besi molding systems are well in place.
Many people of the Advanced Packaging society have been surprised with the outstanding capability of Fico molding systems for transfer mold based wafer level molding, supporting both molded underfill and exposed die. Initially introduced for strip-level the Fico molding solutions are now also available for wafer level applications, which are main target for Advanced Packaging approaches. The Fico molding systems have excellent capabilities for molded underfill and exposed die molding. Finally the SiP world is covered by the Datacon 2200 EVO work horse, a multi chip bonder from its beginning, supporting flip & non-flip attach, including SMD and odd components.īesides die bonding equipment Besi has strong solutions for molding. The platform is prepared for take-off of the 2.5D applications. For the 2.5D/3D applications Besi has the major share of productivity for 3D memory cubes TC Bonding (8800 TC bonder). Besi’s wallet share for eWLB bonder equipment is still close to 100%.
DATACON 2200 EVO FOR SALE SERIES
For FO-WLP Besi introduced the Datacon 8800 CHAMEO series for the Infineon eWLB process. On the die bonder portfolio Besi is leading the mass reflow flip chip bonder market with Datacon 8800 solutions, majorly installed at Asian OSATs.
HP: Using Yole’s language the Advanced Packaging landscape is coarsely divided into Flip Chip, FO-WLP, 2.5D/3D and SiP. YD: As one of the leading suppliers of the semiconductor area, can you explain how Besi is positioned in the Advanced Packaging sector? Besi has a strategic focus on Advanced Packaging equipment. Since 1995, when Besi became a public company, Besi has grown from being a local Dutch system and tooling manufacturer to a world’s leading semiconductor assembly equipment manufacturer, holding now famous backend equipment brands like Fico, Meco, Datacon and Esec.Ĭustomers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. The Company develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. Hugo Pristauz: Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Yole Développement: Can you please introduce Besi product line, its history and current activity ? Learn more about BESI activities and the evolution of the Chinese subcontractor landscape… Hugo Pristauz, BESI Vice President Technical Development Advanced Technology DA, shared with us its view on the evolution of the die bonding, die singulation and molding solutions in addition to the strategy of the Chinese subcontractor in order to be able to compete with their Taiwanese and Korean competitors.
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership.
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